Etching the future one atom at a time
Applied Angstrom Technology is the world's first AI-native semiconductor equipment company. The chips that power AI require equipment powered by AI — our PEDSL platform provides sub-angstrom precision for advanced logic, 3D NAND, DRAM and silicon photonics.
At 3nm and below, atomic layer etch isn't optional. It's the only path.
AI's appetite for compute is rewriting the rules of what a chip must be — and what it takes to build one. Every leading-edge transistor now depends on removing material a single atomic layer at a time, with zero margin for error.
AAT was built clean-sheet, AI-native, for exactly this moment.
AI-driven hardware demand
Data centers, GPUs, HBM and silicon photonics are pulling unprecedented volumes of sub-angstrom-precision equipment into the market.
ALE is indispensable
Sub-nm profile control for GAA nanosheet release, HAR DRAM/NAND structures and photonic waveguide smoothing. Not negotiable below 7nm.
A clean-sheet, AI-native tool
Founders from Intel, Applied Materials and Lam Research — 50+ combined years of etch — building the first platform designed for AI from day one.
Equipment that learns every cycle.
PEDSL pairs decoupled radical and ion control with a machine-learning process loop that tunes gas flow, power and timing in real time — delivering tighter uniformity and far faster recipe development than any manually tuned legacy tool.
- ArchitecturePlasma-Enhanced Decoupled Self-Limiting
- Anisotropic or IsotropicBKM1 throughput · BKM2 precision
- Capabilities High Throughput and High PrecisionSingle, dual-mode
Self-limiting. Real.
A Class 100 cleanroom, live in Singapore.
Our 10,000 sq ft facility at Singapore One-North is fully operational — running process development, equipment demonstration and active qualification.
- Facility10,000 sq ft · Class 100
- StatusQualifying customer processes
- IP2 PCT filed · 10+ in pipeline